The New Jersey Institute of Technology's
Electronic Theses & Dissertations Project

Title:	Design of mask for striped filters and thin-film multi-layer emissivity modeling for multi-wavelength imaging pyrometer
Author:	Shah, Jitesh Navinchandra
View Online:	njit-etd1993-142 (xii, 78 pages ~ 2.6 MB pdf)
Department:	Department of Electrical and Computer Engineering
Degree:	Master of Science
Program:	Electrical Engineering
Document Type:	Thesis
Advisory Committee:	Kosonocky, Walter F. (Committee co-chair) Misra, Durgamadhab (Committee co-chair) Ravindra, N. M. (Committee member)
Date:	1993-10
Keywords:	Pyrometers and pyrometry. Thin films, Multilayered. Light filters.
Availability:	Unrestricted
Abstract:	Multi-Wavelength Imaging Pyrometry (M-WIP) measures thermal radiation of any target (color or gray) in multiple narrow-spectral-regions and can simultaneously determine target temperature and emissivity. One approach for measuring radiation at multiple wavelengths using a 320X244 element Pt-Si SBD infrared camera is to use narrow-band striped filters deposited on a transparent substrate with proper alignment. The major focus of this thesis was the design of a four layer mask for investigating the feasibility of defining three-wavelength striped filters compatible with focal plane array. This mask design allows twelve distinct narrow band striped filter geometries and four test-patterns on a 4-inch silicon wafer. Prior knowledge of spectral and directional emissivity as a function of thickness of the layer being etched or deposited has extreme importance in improving operating parameters of M-WIP such as selection of spectral range and number of required wavelength. A detailed study of spectral (2.5 µm to 5.0 µm) and directional (0° and 80° from the normal of surface) emissivity variation of thin-film multilayer structure was done, using the developed model, for several important structures commonly used in plasma etching. These multi-layer structures are Poly-Si on thin and thick oxides, silicides on thick oxides and polysides on thin oxides. This analysis can be easily extended to other processing techniques such as sputtering, evaporation, CVD and RTP.