Articles via Databases
Articles via Journals
Online Catalog
E-books
Research & Information Literacy
Interlibrary loan
Theses & Dissertations
Collections
Policies
Services
About / Contact Us
Administration
Littman Architecture Library
This site will be removed in January 2019, please change your bookmarks.
This page will redirect to https://digitalcommons.njit.edu/theses/3 in 5 seconds

The New Jersey Institute of Technology's
Electronic Theses & Dissertations Project

Title: Heat transfer in silicon - experiments and simulation
Author: Huang, Chihlin
View Online: njit-etd2017-024
(xiv, 68 pages ~ 3.2 MB pdf)
Department: Committee for the Interdisciplinary Program in Materials Science and Engineering
Degree: Master of Science
Program: Materials Science and Engineering
Document Type: Thesis
Advisory Committee: Ravindra, N. M. (Committee chair)
Jaffe, Michael (Committee member)
Lee, Eon Soo (Committee member)
Date: 2017-01
Keywords: Heat transfer
Silicon wafers
Semiconductor processing
Availability: Unrestricted
Abstract:

The purpose of this thesis is to study the heat transfer in silicon. Silicon is the key semiconductor material, and thermal processing is the traditional method that is used in semiconductor processing. In this research, we can predict the temperature of the silicon wafer during heating. This ability to predict wafer temperature during semiconductor processing will facilitate in the following: (a) Process temperature uniformity, (b) Film thickness uniformity, (c) Diffusion, (d) Process yield, (e) Thermally induced stresses, and (f) Device yield - spatially and temporally across the wafer. For low temperature applications, IC chips can be modeled to simulate the heat flow. Therefore, the status of the chip while heating can be studied to understand the influence of the heating process on the performance of the chips, which is useful in the assessment of device performance and reliability.

The research, in this thesis, utilizes a traditional hot plate as the source of heating of the silicon wafer. The modeling of heating of the wafer is based on ANSYS CFX software, a software tool that permits to solve fluid flow problems. The model considers heat conduction in silicon wafer, heat convection in air, and heat radiation. The influence of silicon wafer thickness and diameter on the wafer temperature distribution is simulated.


If you have any questions please contact the ETD Team, libetd@njit.edu.

 
ETD Information
Digital Commons @ NJIT
Theses and DIssertations
ETD Policies & Procedures
ETD FAQ's
ETD home

Request a Scan
NDLTD

NJIT's ETD project was given an ACRL/NJ Technology Innovation Honorable Mention Award in spring 2003