The New Jersey Institute of Technology's
Electronic Theses & Dissertations Project

Title:	Effect of temperature on the fracture behavior of lead-free solder joints
Author:	Thompson, Patrick
View Online:	njit-etd2016-060 (viii, 23 pages ~ 1.4 MB pdf)
Department:	Department of Mechanical and Industrial Engineering
Degree:	Master of Science
Program:	Mechanical Engineering
Document Type:	Thesis
Advisory Committee:	Nadimpalli, Siva P.V. (Committee chair) Rao, I. Joga (Committee member) Rosato, Anthony D. (Committee member) Chester, Shawn Alexander (Committee member)
Date:	2016-05
Keywords:	Fracture behavior Lead-free solder joints Temperature effects
Availability:	Unrestricted
Abstract:	The objective of the present study is to examine the effect of temperature on the fracture behavior of Cu-SAC305-Cu joints. To this end, double cantilever beam (DCB) specimens, consisting of a thin layer of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under various temperatures with a MTS machine equipped with an environment chamber. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure and the displacements near crack tip are recorded and used to calculate the fracture energy release rates. The fracture surfaces and the crack path analyses are conducted with a scanning electron microscope to understand the effect of temperature on the mechanism of fracture. These results provide new information to manufacturers of microelectronics packages, which could be used to further improve package reliability.