Grebel, Haim (Committee chair)
Sirenko, Andrei (Committee member)
Tsybeskov, Leonid (Committee member)
Sohn, Kenneth (Committee member)
Misra, Durgamadhab (Committee member)
Date:
2009-08
Keywords:
Carbon nanotube intra-connects
E-beam lithography
Availability:
Unrestricted
Abstract:
Growth of individual carbon nanotube (CNT) intra-connects (bridges) between two prefabricated electrodes is a great challenge and a pre-requisite to the development of single electron devices. In this thesis, CNT intra-connects were fabricated and studied. Later on, the intra-connects were deposited with electrically conductive polymer (ECP) in the realization of CNT/ECP hybrids.
The process started by realizing two electrodes with sharp end on a silicon wafer using e-beam lithography. The intra-connects were then grown by use of chemical vapor deposition (CVD) technique. The intra-connects were later electroplated by various conductive polymers. The morphology, electrical conductivity of these intra-connects as well as their Raman spectroscopy signatures were studied. Scanning electron microscopy (SEM) was also employed. The CNT intra-connects were well-aligned from tip to tip. Their Raman spectra indicated the existence of CNT channels between metal tips and nowhere else on the wafer. Enhancement of photoconductance has been shown to correlate with a novel negative differential resistance (NDR) effect. Electroplated intraconnects exhibited unique properties both for multi-walled and single-walled carbon nanotube channels.
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