The New Jersey Institute of Technology's
Electronic Theses & Dissertations Project

Title:	Design and fabrication of a miniature pressure sensor head using direct bonded ultra-thin silicon wafers
Author:	Statler, Chad Eugene
View Online:	njit-etd1996-097 (x, 39 pages ~ 1.9 MB pdf)
Department:	Department of Physics
Degree:	Master of Science
Program:	Applied Physics
Document Type:	Thesis
Advisory Committee:	Farmer, Kenneth Rudolph (Committee chair) Federici, John Francis (Committee member) Carr, William N. (Committee member)
Date:	1996-05
Keywords:	Pressure transducers. Integrated circuits--Wafer-scale integration.
Availability:	Unrestricted
Abstract:	A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane directly bonded to an excimer laser micromachined substrate. The pressure sensor head has its intended implementation as part of an optically interrogated device with sensitivity to pressures ranging from 0.5 to 4.0 MPa. The pressure range design is shown to be easily adjusted by tailoring the thickness of the membrane wafer. The fabrication process features numerous advantages over existing pressure sensor construction technology including a maskless procedure and no chemical etching or mechanical thinning necessary to form the membrane after bonding. An optic lever is constructed and tested using a reflective aluminum surface. The response of the optic lever device was found to be 160 mV/µm in the linear region.